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Testing activities

Destructive physical analysis

DPA is a detailed examination of EEE components at various stages of physical disassembly. This test verifies that the component quality is in accordance with the detailed project requirements.

Destructive physical analysis

In a DPA test, components are examined for a wide variety of design and processing problems that may not show up during the previous inspection, test and screening activities performed by the component manufacturer. Defects and problems which are detected through DPA test could cause failure of the system.

This test is conducted on samples taken randomly from the lot and include a series of different tests and inspections depending on the type of the component.

DPA test involves

  • External Visual Inspection
  • X-ray Examination
  • Seal tests (Fine and Gross leaks)
  • P.I.N.D test (Particle Impact Noise Detection)
  • Solderability
  • Internal Visual Inspection
  • Bond Shear
  • Bond Pull
  • Scanning Electron Microscope (SEM)
  • Die Shear

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